1 This specification provides a flexible, low-cost, High-Speed serial interface solution for communication
2 interconnection between components inside a mobile device. Traditionally, these interfaces are CMOS
3 parallel busses at low bit rates with slow edges for EMI reasons. The D-PHY solution enables significant
4 extension of the interface bandwidth for more advanced applications. The D-PHY solution can be realized
5 with very low power consumption.
10
Alliance application or protocol level specifications. This includes the physical interface, electrical interface, 11
low-level timing and the PHY-level protocol. The goal has been to define a C-PHY high-speed interface that 12
can coexist on the same pins as the MIPI D-PHY interface. These functional areas taken together are known 13
as C-PHY.
This specification provides a flexible, low-cost, High-Speed serial interface solution for communication 287
interconnection between components inside a mobile device. Traditionally, these interfaces are CMOS 288
parallel busses at low bit rates with slow edges for EMI reasons. The D-PHY solution enables significant 289
extension of the interface bandwidth for more advanced applications. The D-PHY solution can be realized 290
with very low power consumption.
The Display Serial Interface Specification defines protocols between a host processor and peripheral devices 2 that adhere to MIPI Alliance Specifications for mobile device interfaces. The DSI Specification builds on
3 existing specifications by adopting pixel formats and command set defined in [MIPI02], [MIPI03], and
4 [MIPI01].
